Conference Dates
October 1-6, 2017
Abstract
When looking for industrial applications environmental compatible solutions are highly desired. When looking at microelectronics miniaturization, functionalization and performance are also highly required. When looking at technologies for deposition of thick films electrophoretic deposition (EPD) is attracting increasing interest for a wide range of technical applications due to its high flexibility, low cost and simplicity of management, facility to fabricate intricate shapes and to be scaled-up for large volume fabrication. Within this context in this work aqueous based electrophoretic deposition (EPD) of lead free sodium potassium niobate (KNN) is demonstrated. The goal of our work is to establish the range of conditions in which aqueous deposition of KNN films is possible. By the use of a relatively environmental friendly additive, such as sodium dodecyl sulfate (SDS), high quality crack and defect free KNN films are prepared. The deposition mechanism and the electromechanical performance of these films are presented and discussed. KNN thick films on metallic substrates with thickness varying between 10 - 15 µm have dielectric permittivity of 495, dielectric losses of 0.08 at 1 MHz and a piezoelectric coefficient d33 of ~70 pC/N. At TC (≈405 °C), these films exhibit a relative permittivity of 2166 and loss tangent of 0.11 at 1 MHz. A comparison of the physical properties between these films and their bulk ceramics counterparts demonstrates the impact of aqueous based EPD technique for the preparation of lead free ferroelectric thick films. This opens the door to the possible development of high-performance, lead-free piezoelectric thick films by a sustainable low cost process, expanding the applicability of lead free piezoelectrics.
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Recommended Citation
Paula Vilarinho, Amit Mahajan, Rui Pinho, M. Elisabete Costa, and Morgane Dolhen, "ENVIRONMENTALLY FRIENDLY PROCESSING OF LEAD FREE SODIUM POTASSIUM NIOBATE THICK FILMS BY ELECTROPHORETIC DEPOSITION" in "Electrophoretic Deposition VI: Fundamentals and Applications", Aldo R. Boccaccini, Institute of Biomaterials, University of Erlangen-Nuremberg, Germany Omer van der Biest, Department of Metallurgy and Materials Engineering, Katholieke Universiteit Leuven, Belgium James Dickerson, Consumer Reports, USA Tetsuo Uchikoshi, National Institute for Materials Science, Japan Eds, ECI Symposium Series, (2017). https://dc.engconfintl.org/electrophoretic_vi/43