May 16-21, 2010
Plasma-enhanced chemical vapour deposition is an attractive technqiue to provide particles with a thin film. Applying a cold plasma enables us to work with temperature-sensitive materials. Using a CFB with an incorporated volume dielectric barrier discharge reactor we coated 20-30 m CuO particles with a thin SiOx layer.
J. Ruud van Ommen, Elena Abadjieva, and Yves L.M. Creyghton, "PLASMA-ENHANCED CHEMICAL VAPOUR DEPOSITION ON PARTICLES IN AN ATMOSPHERIC CIRCULATING FLUIDIZED BED" in "The 13th International Conference on Fluidization - New Paradigm in Fluidization Engineering", Sang Done Kim,Korea Advanced Institute of Science and Technology, Korea; Yong Kang, Chungnam National University, Korea; Jea Keun Lee, Pukyong National University, Korea; Yong Chil Seo, Yonsei University, Korea Eds, ECI Symposium Series, (2010). http://dc.engconfintl.org/fluidization_xiii/68