Elastic-plastic fracture toughness of electrodeposited Ni-W thick films using in-situ microcantilever bend tests
October 1-6, 2017
Nanocrystalline materials have been shown to exhibit properties superior to their coarse-grained counterparts. Nanocrystalline Ni-W is no exception and is a promising replacement for nanocrystalline Ni and hard chromium, with prospect in the electronics, microfabrication technology, automobile, and aerospace industries. In spite of having desirable properties, Ni-W exhibits a certain brittleness that if not mitigated, could lead to premature failure. This study investigates the fracture behavior of Ni-W and establishes structure-property relationships via correlation to the microstructure. Due to non-negligible plastic yielding, conventional linear elastic fracture mechanics was insufficient in quantifying the fracture toughness, and novel elastic-plastic fracture mechanics had to be used.
Please click Additional Files below to see the full abstract.
Denise Yin and Christopher Marvel, "Elastic-plastic fracture toughness of electrodeposited Ni-W thick films using in-situ microcantilever bend tests" in "Nanomechanical Testing in Materials Research and Development VI", Karsten Durst, Technical University of Darmstadt, Germany Eds, ECI Symposium Series, (2017). http://dc.engconfintl.org/nanomechtest_vi/111