A new push‐pull sample design for microscale mode 1 fracture toughness measurements under uniaxial tension
October 1-6, 2017
The miniaturization of microelectronic devices and the use of thin hard coatings have led to an increased demand for knowledge on the fracture behaviour of microscopic structures. A new geometry called Micro-SENT is proposed in this work that allows performing experiments in uniaxial tension on the microscale using a standard flat punch indenter by making use of a symmetric push-pull sample design. This enables the measurement of mode 1 fracture toughness under uniform tensional far-field loading as opposed to current state of the art approaches based on cantilever bending or micropillar splitting.
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Johann Jakob Schwiedrzik, Xavier Maeder, Laszlo Pethö, Johann Michler, and Johannes Ast, "A new push‐pull sample design for microscale mode 1 fracture toughness measurements under uniaxial tension" in "Nanomechanical Testing in Materials Research and Development VI", Karsten Durst, Technical University of Darmstadt, Germany Eds, ECI Symposium Series, (2017). http://dc.engconfintl.org/nanomechtest_vi/13