A new push‐pull sample design for microscale mode 1 fracture toughness measurements under uniaxial tension

Conference Dates

October 1-6, 2017


The miniaturization of microelectronic devices and the use of thin hard coatings have led to an increased demand for knowledge on the fracture behaviour of microscopic structures. A new geometry called Micro-SENT is proposed in this work that allows performing experiments in uniaxial tension on the microscale using a standard flat punch indenter by making use of a symmetric push-pull sample design. This enables the measurement of mode 1 fracture toughness under uniform tensional far-field loading as opposed to current state of the art approaches based on cantilever bending or micropillar splitting.

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