The effect of thermally induced stresses on indentation experiments

Conference Dates

October 1-6, 2017


The preparation of most composite materials involve processing steps that are performed at elevated temperatures. At high temperatures, temperature activated deformation processes typically allow the material to reduce the stress level. After cooling to room temperature, the common consensus is that composites and coated samples are subject to intrinsic stresses due to the mismatch in the thermal expansion coefficient (CTE).

The intrinsic stresses caused by the CTE can be varied by changing the temperature of the sample, and the effect of stress is evident in the load displacement curve of the indentation experiments. Ultrahigh-speed mapping of indentations enables an increase in the statistical relevance of the values found.

The effect of thermal stresses on Cu, ULK porous films and thermally grown oxide films at varying temperatures was studied in the xSOL heating stage, where the combination of in-situ SPM imaging and indentation experiments allows visualizing the effects on the materials.

The effect of different environments on the experiment will also be discussed.

The technical solutions available on Bruker’s Hysitron stand-alone systems and those instruments that are typically used in a vacuum environment will be compared.

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