Title
Ni-P: Microstructure and micro-compression
Conference Dates
September 29-October 4, 2019
Abstract
Electroless nickel-phosphorus (EN-P) plating is a popular deposition process with widespread applications in microelectronics [1, 2]. Much emphasis has been given on the plating process and on the physical and chemical properties of the EN-P layers; however their mechanical properties down to the sub-micrometer dimensions have not been elucidated systematically. In this work, we study the mechanical properties of EN-P as a function of annealing states using in-situ pillar compression technique [3].
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Recommended Citation
Chaowei Du, Kurt Matoy, Johannes Zechner, Michael Reisinger, Werner Robl, Robert Hartl, Christoph Kirchlechner, and Gerhard Dehm, "Ni-P: Microstructure and micro-compression" in "Nanomechanical Testing in Materials Research and Development VII", Jon Molina-Aldareguia, IMDEA-Materials Institute, Spain Eds, ECI Symposium Series, (2019). https://dc.engconfintl.org/nanochemtest_vii/31