Ni-P: Microstructure and micro-compression

Conference Dates

September 29-October 4, 2019


Electroless nickel-phosphorus (EN-P) plating is a popular deposition process with widespread applications in microelectronics [1, 2]. Much emphasis has been given on the plating process and on the physical and chemical properties of the EN-P layers; however their mechanical properties down to the sub-micrometer dimensions have not been elucidated systematically. In this work, we study the mechanical properties of EN-P as a function of annealing states using in-situ pillar compression technique [3].

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