Semiconductor process chamber coatings: Improving performance and uptime
June 24-29, 2018
Corrosion resistance is a critical property for semiconductor processing chamber components. Corrosive plasmas are omnipresent is semiconductor deposition processes, including plasma enhanced chemical vapor deposition (PECVD), physical vapor deposition (PVD), and etching. Process chamber cleanliness during plasma processing is becoming increasingly important as device feature sizes shrink. Particles that originate from erosion of the chamber components can lead to device yield losses, and eventually will result in the process chamber requiring the replacement of chamber components that are exposed to such plasmas. Thus the chamber components coatings are critical for tool performance and uptime.
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David A. Britz, "Semiconductor process chamber coatings: Improving performance and uptime" in "Thermal Barrier Coatings V", Prof. Dr. Robert Vaßen, Forschungszentrum Jülich GmbH, Germany Brian Hazel, Pratt & Whitney, USA Prof. Dr. Uwe Schulz, German Aerospace Center, Germany Dr. Michael J. Maloney, Pratt & Whitney, USA Dr. Ram Darolia, GE Aviation (Retired), USA Eds, ECI Symposium Series, (2018). https://dc.engconfintl.org/tbcv/46