SiGeSn/GeSn hetero- and multiple quantum well structures for optoelectronics on Si

Conference Dates

May 21-25, 2017


Advanced information technology has to be able to cope with the enormous amounts and rates of data requirements. New architectures of computing systems, such as neuromorphic computing, will enable deep learning and massive parallel data handling. However, it will need also large amounts of data for training as well as fast transfer rates of data between logic and storage devices. Here, advanced chip and board designs, including silicon optical interposer may allow much higher density of signal traces between co-packaged chips. In particular co-packaged silicon photonic chips allow optical interconnections between systems-in-package. Thus silicon interposer can directly contain photonic devices based on group alloys. In a long term vision this technology might be enabled by GeSn lasers permitting to connect optically individual chips within the system-in-package.In the past years significant progress has been made to develop optically active devices based on Si. A direct band gap for GeSn alloys containing more than 8.5% of Sn was demonstrated and the optically pumped GeSn laser were reported [1,2]. In order to improve the device performance and achieve electrical operation at sufficiently low power still severe challenges have to be met. The GeSn active region has to be embedded in a heterostructure providing optical waveguiding and efficient carrier injection. The active region may contain quantum well structures to warrant low threshold currents and room temperature operation.

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