Novel rheological measurements to understand structural stability of DIW- printed epoxy composites during thermal curing
Conference Dates
January 8 - 13, 2024
Abstract
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Recommended Citation
Stian Romberg, Sarah Lehrman, Chad Snyder, Jonathan Seppala, and Anthony Kotula, "Novel rheological measurements to understand structural stability of DIW- printed epoxy composites during thermal curing" in "Innovative Materials & Methods for Additive Manufacturing II (IM²AM)", Daniel Schmidt, Luxembourg Institute of Science and Technology (LIST), Luxembourg; Nikhil Gupta, New York University, USA; Eric Eastwood, KCNSC/Honeywell FM&T, USA; Brett Compton, University of Tennessee, Knoxville, USA; Gary M. Gladysz, Los Alamos National Laboratory, USA Eds, ECI Symposium Series, (2024). https://dc.engconfintl.org/imam_ii/31