Enhanced thermal conductivity and fracture toughness in additive manufacturing through graphene-diamond composites

Authors

Shani Ligati Schleifer, Ben Gurion University of the Negev, IsraelFollow
Oren Regev, Department of chemical engineering, The Ilse Katz Institute for Nanoscale Science and Technology, Ben Gurion University of the Negev, Israel.

Conference Dates

January 8 - 13, 2024

Abstract

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Recommended Citation

Shani Ligati Schleifer and Oren Regev, "Enhanced thermal conductivity and fracture toughness in additive manufacturing through graphene-diamond composites" in "Innovative Materials & Methods for Additive Manufacturing II (IM²AM)", Daniel Schmidt, Luxembourg Institute of Science and Technology (LIST), Luxembourg; Nikhil Gupta, New York University, USA; Eric Eastwood, KCNSC/Honeywell FM&T, USA; Brett Compton, University of Tennessee, Knoxville, USA; Gary M. Gladysz, Los Alamos National Laboratory, USA Eds, ECI Symposium Series, (2024). https://dc.engconfintl.org/imam_ii/7