Title

Correlative in situ total and elastic strain mapping on micromechanical test pieces by DIC and HR-EBSD

Conference Dates

September 29-October 4, 2019

Abstract

The measurement of elastic strains and stress in micromechanical testpieces upon loading has previously been performed by in-situ X-ray synchrotron diffraction and high resolution electron backscatter diffraction (HR-EBSD). Similarly, the measurement of total, elastic and plastic, strains by the technique of digital image correlation (DIC) strain mapping, has recently been performed on micropillars using an applied surface speckle pattern.

Please click Additional Files below to see the full abstract.

54.pdf (240 kB)

This document is currently not available here.

Share

COinS