Correlative in situ total and elastic strain mapping on micromechanical test pieces by DIC and HR-EBSD
September 29-October 4, 2019
The measurement of elastic strains and stress in micromechanical testpieces upon loading has previously been performed by in-situ X-ray synchrotron diffraction and high resolution electron backscatter diffraction (HR-EBSD). Similarly, the measurement of total, elastic and plastic, strains by the technique of digital image correlation (DIC) strain mapping, has recently been performed on micropillars using an applied surface speckle pattern.
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Thomas E.J. Edwards, Xavier Maeder, Johann Michler, and Johannes Ast, "Correlative in situ total and elastic strain mapping on micromechanical test pieces by DIC and HR-EBSD" in "Nanomechanical Testing in Materials Research and Development VII", Jon Molina-Aldareguia, IMDEA-Materials Institute, Spain Eds, ECI Symposium Series, (2019). https://dc.engconfintl.org/nanochemtest_vii/92