Correlative in situ total and elastic strain mapping on micromechanical test pieces by DIC and HR-EBSD

Conference Dates

September 29-October 4, 2019


The measurement of elastic strains and stress in micromechanical testpieces upon loading has previously been performed by in-situ X-ray synchrotron diffraction and high resolution electron backscatter diffraction (HR-EBSD). Similarly, the measurement of total, elastic and plastic, strains by the technique of digital image correlation (DIC) strain mapping, has recently been performed on micropillars using an applied surface speckle pattern.

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