Multi scale micromechanical testing for new polymer core solder ball (PCSB) interconnections reliability in operating conditions

Authors

• Sergio Sao-Joao, Mines Saint-Etienne, Laboratoire Georges Friedel, CNRS, Saint Etienne, FranceFollow
• Irati Malkorra, Mines Saint-Etienne, Laboratoire Georges Friedel, CNRS UMR 5307, Saint Etienne – France
• Guillaume Kermouche, Mines Saint-Etienne, Laboratoire Georges Friedel, CNRS UMR 5307, Saint Etienne – France

Conference Dates

October 6-11, 2024

Abstract

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Recommended Citation

Sergio Sao-Joao, Irati Malkorra, and Guillaume Kermouche, "Multi scale micromechanical testing for new polymer core solder ball (PCSB) interconnections reliability in operating conditions" in "Nanomechanical Testing in Materials Research and Development IX", Marco Sebastiani, Universita degli studi Roma Tre, Italy Eds, ECI Symposium Series, (2024). https://dc.engconfintl.org/nanomechtest_ix/19