Micromechanical investigation of lead-free soft solder by in-situ microcompression experiments and advanced nanoindentation
Conference Dates
October 6-11, 2024
Abstract
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Recommended Citation
Nadine Buchebner, Verena Maier-Kiener, Daniel Kiener, and Julius Keckes, "Micromechanical investigation of lead-free soft solder by in-situ microcompression experiments and advanced nanoindentation" in "Nanomechanical Testing in Materials Research and Development IX", Marco Sebastiani, Universita degli studi Roma Tre, Italy Eds, ECI Symposium Series, (2024). https://dc.engconfintl.org/nanomechtest_ix/36