Understanding the grain boundary sliding behavior in Ni bicrystal via in situ high temperature pillar compression
Conference Dates
October 6-11, 2024
Abstract
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Recommended Citation
Divya Sri Bandla, Subin y Lee, and Christoph Kirchlechner, "Understanding the grain boundary sliding behavior in Ni bicrystal via in situ high temperature pillar compression" in "Nanomechanical Testing in Materials Research and Development IX", Marco Sebastiani, Universita degli studi Roma Tre, Italy Eds, ECI Symposium Series, (2024). https://dc.engconfintl.org/nanomechtest_ix/44