Room temperature migration of a σ5 copper grain boundary during micropillar compression

Authors

• Mohammed Kamran Bhat, Max-Planck-Institut für Nachhaltige Materialien GmbH, GermanyFollow
• Hui Ding, Max-Planck-Institut für Eisenforschung GmbH
• Gerhard Dehm, Max-Planck-Institut für Eisenforschung GmbH
• James P. Best, Max-Planck-Institut für Eisenforschung GmbH
• Mohamed Elkot, Max-Planck-Institut für Eisenforschung GmbH

Conference Dates

October 6-11, 2024

Abstract

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Recommended Citation

Mohammed Kamran Bhat, Hui Ding, Gerhard Dehm, James P. Best, and Mohamed Elkot, "Room temperature migration of a σ5 copper grain boundary during micropillar compression" in "Nanomechanical Testing in Materials Research and Development IX", Marco Sebastiani, Universita degli studi Roma Tre, Italy Eds, ECI Symposium Series, (2024). https://dc.engconfintl.org/nanomechtest_ix/76