Conference Dates
October 4-9, 2015
Abstract
Polymer films for the use of coating or structuring applications for small scale devices are widely used. For the raw bulk material the thermal and mechanical data are easily accessible and often supplied by the manufacturer. For the final use as a thin film, the verification of these properties is more difficult. Nanoindentation techniques can be used for the characterization of thin film due to the small-scaled mechanical stress field of the nanoindenter tip. Studies comparing nanoindentation data on bulk polymer samples with conventional DMA data show a good agreement in storage and in loss modulus [1]. Since thermal properties of polymers are often important, indentation tests at non-ambient temperatures are required. By using an actively heated tip, we are able to study these properties under isothermal conditions. We will show results on heated polymer samples for semiconductor applications and discuss the influence of the heating method to the results.
Recommended Citation
[1]: Thermo-mechanical material characterization of organic polymer films in advanced packages using nanoindentation, K. Unterhofer, H. Preu, J. Walter, G. Lorenz, W. Mack, M. Petzold, EMPC conference, (2013), ISBN: 978-2-95-274671-7