Title
Investigating adhesion of polyimide in semiconductor devices with cross-sectional nanoindentation
Conference Dates
October 2 – 7, 2022
Abstract
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Recommended Citation
Moritz Hartleb, Peter Julian Imrich, and Johannes Zechner, "Investigating adhesion of polyimide in semiconductor devices with cross-sectional nanoindentation" in "Nanomechanical Testing in Materials Research and Development VIII", Sandra Korte-Kerzel, RWTH Aachen University, Germany Eds, ECI Symposium Series, (2022). https://dc.engconfintl.org/nanomechtest_viii/21
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