Title
Nano mechanical and microstructural investigation of damage mechanisms in copper wire bonds
Conference Dates
October 2 – 7, 2022
Abstract
Please click Additional Files below to see the full abstract.
Recommended Citation
Liz Karanja, Pierre-Yves Pichon, and Marc Legros, "Nano mechanical and microstructural investigation of damage mechanisms in copper wire bonds" in "Nanomechanical Testing in Materials Research and Development VIII", Sandra Korte-Kerzel, RWTH Aachen University, Germany Eds, ECI Symposium Series, (2022). https://dc.engconfintl.org/nanomechtest_viii/38
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