Title
Additive micromanufacturing and dynamic characterization of copper microlattices
Conference Dates
October 2 – 7, 2022
Abstract
Microfabrication technologies are vital for the manufacturing of computer chips, electronic devices and microelectromechanical systems (MEMS). The most common methodology for microfabrication is using ultraviolet (UV) based expose-and-etch based lithographic methods. This method, though ubiquitous in several industrial applications, is only suited for fabricating 2.5D architectures and true 3D architectures such as springs, helices or lattices cannot be obtained. In this presentation, I will introduce a recent additive micromanufacturing method that is based on localized electrodeposition of microscale metal droplets.
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Recommended Citation
Rajaprakash Ramachandramoorthy, Szilvia Kalácska, Amit Sharma, Manish Jain, Sung-Gyu Kang, Jakob Schwiedrzik, Xavier Maeder, and Johann Michler, "Additive micromanufacturing and dynamic characterization of copper microlattices" in "Nanomechanical Testing in Materials Research and Development VIII", Sandra Korte-Kerzel, RWTH Aachen University, Germany Eds, ECI Symposium Series, (2022). https://dc.engconfintl.org/nanomechtest_viii/86