Additive micromanufacturing and dynamic characterization of copper microlattices

Conference Dates

October 2 – 7, 2022


Microfabrication technologies are vital for the manufacturing of computer chips, electronic devices and microelectromechanical systems (MEMS). The most common methodology for microfabrication is using ultraviolet (UV) based expose-and-etch based lithographic methods. This method, though ubiquitous in several industrial applications, is only suited for fabricating 2.5D architectures and true 3D architectures such as springs, helices or lattices cannot be obtained. In this presentation, I will introduce a recent additive micromanufacturing method that is based on localized electrodeposition of microscale metal droplets.

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