Process and Reliability of Ferroelectric Aluminum Scandium Nitride Films
Conference Dates
March 30 - April 3, 2025
Abstract
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Recommended Citation
Kuniyuki Kakushima, "Process and Reliability of Ferroelectric Aluminum Scandium Nitride Films" in "2025 International Conference on Semiconductor Technology for Ultra Large-Scale Integrated Circuits and Thin Film Transistors (ULSIC VS TFT 9)", Yue Kuo, Texas A&M University & National Yang Ming Chiao Tung University Eds, ECI Symposium Series, (2025). https://dc.engconfintl.org/international_conference_on_semiconductor_technology/16
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